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  ? semiconductor components industries, llc, 2004 december, 2004 ? rev. 9 1 publication order number: mc74hc02a/d mc74hc02a quad 2-input nor gate high?performance silicon?gate cmos the mc74hc02a is identical in pinout to the ls02. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. features ? pb?free packages are available* ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2.0 to 6.0 v ? low input current: 1.0  a ? high noise immunity characteristic of cmos devices ? in compliance with the requirements defined by jedec standard no. 7.0 a ? chip complexity: 40 fets or 10 equivalent gates logic diagram 1 y1 2 a1 pin 14 = v cc pin 7 = gnd 3 b1 y4 y = a + b 4 y2 5 a2 6 b2 10 y3 8 a3 9 b3 13 11 a4 12 b4 pin assignment 11 12 13 14 8 9 10 5 4 3 2 1 7 6 y3 a4 b4 y4 v cc a3 b3 y2 b1 a1 y1 gnd b2 a2 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. marking diagrams a = assembly location wl or l = wafer lot yy or y = year ww or w = work week tssop?14 dt suffix case 948g hc 02a alyw 1 14 1 14 pdip?14 n suffix case 646 mc74hc02an awlyyww soic?14 d suffix case 751a 1 14 hc02a awlyww function table a l l h h inputs output b l h l h y h l l l see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information http://onsemi.com
mc74hc02a http://onsemi.com 2 ??????????????????????? ??????????????????????? maximum ratings* ???? ???? symbol ?????????????? ?????????????? parameter ????? ????? value ??? ??? unit ???? ???? v cc ?????????????? ?????????????? dc supply voltage (referenced to gnd) ????? ????? 0.5 to + 7.0 ??? ??? v ???? ???? v in ?????????????? ?????????????? dc input voltage (referenced to gnd) ????? ????? 0.5 to v cc + 0.5 ??? ??? v ???? ???? v out ?????????????? ?????????????? dc output voltage (referenced to gnd) ????? ????? 0.5 to v cc + 0.5 ??? ??? v ???? ???? i in ?????????????? ?????????????? dc input current, per pin ????? ????? 20 ??? ??? ma ???? ???? i out ?????????????? ?????????????? dc output current, per pin ????? ????? 25 ??? ??? ma ???? ???? i cc ?????????????? ?????????????? dc supply current, v cc and gnd pins ????? ????? 50 ??? ??? ma ???? ? ?? ? ???? p d ?????????????? ? ???????????? ? ?????????????? power dissipation in still air, plastic dip2 soic package2 tssop package2 ????? ? ??? ? ????? 750 500 450 ??? ? ? ? ??? mw ???? ???? t stg ?????????????? ?????????????? storage temperature ????? ????? 65 to + 150 ??? ???  c ???? ? ?? ? ???? t l ?????????????? ? ???????????? ? ?????????????? lead temperature, 1 mm from case for 10 seconds plastic dip, soic or tssop package ????? ? ??? ? ????? 260 ??? ? ? ? ???  c ??????????????????????? ? ????????????????????? ? ? ????????????????????? ? ??????????????????????? maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 2derating e plastic dip: 10 mw/  c from 65  to 125  c soic package: 7 mw/  c from 65  to 125  c tssop package: ? 6.1 mw/  c from 65  to 125  c for high frequency or heavy load considerations, see chapter 2 of the on semiconductor high?speed cmos data book (dl129/d). recommended operating conditions ???? ???? symbol ??????????????? ??????????????? parameter ??? ??? min ?? ?? max ??? ??? unit ???? ???? v cc ??????????????? ??????????????? dc supply voltage (referenced to gnd) ??? ??? 2.0 ?? ?? 6.0 ??? ??? v ???? ???? v in , v out ??????????????? ??????????????? dc input voltage, output voltage (referenced to gnd) ??? ??? 0 ?? ?? v cc ??? ??? v ???? ???? t a ??????????????? ??????????????? operating temperature, all package types ??? ??? 55 ?? ?? + 125 ??? ???  c ???? ? ?? ? ???? t r , t f ??????????????? ? ????????????? ? ??????????????? input rise and fall time v cc = 2.0 v (figure 1) v cc = 4.5 v v cc = 6.0 v ??? ? ? ? ??? 0 0 0 ?? ?? ?? 1000 500 400 ??? ? ? ? ??? ns this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high?impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd  (v in or v out )  v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc02a http://onsemi.com 3 ????????????????????????????????? ????????????????????????????????? dc electrical characteristics (voltages referenced to gnd) ???? ???? ????????? ????????? ????????? ????????? ???? ???? ????????? ????????? guaranteed limit ??? ??? ???? ? ?? ? ???? symbol ????????? ? ??????? ? ????????? parameter ????????? ? ??????? ? ????????? test conditions ???? ? ?? ? ???? v cc v ???? ? ?? ? ???? 55 to 25  c ??? ? ? ? ???  85  c ???? ? ?? ? ????  125 c ??? ? ? ? ??? unit ???? ? ?? ? ???? v ih ????????? ? ??????? ? ????????? minimum high?level input voltage ????????? ? ??????? ? ????????? v out = 0.1 v or v cc 0.1 v |i out |  20  a ???? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ???? 1.5 2.1 3.15 4.2 ??? ? ? ? ??? 1.5 2.1 3.15 4.2 ???? ? ?? ? ???? 1.5 2.1 3.15 4.2 ??? ? ? ? ??? v ???? ? ?? ? ? ?? ? ???? v il ????????? ? ??????? ? ? ??????? ? ????????? maximum low?level input voltage ????????? ? ??????? ? ? ??????? ? ????????? v out = 0.1 v or v cc 0.1 v |i out |  20  a ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 0.5 0.9 1.35 1.8 ??? ? ? ? ? ? ? ??? 0.5 0.9 1.35 1.8 ???? ? ?? ? ? ?? ? ???? 0.5 0.9 1.35 1.8 ??? ? ? ? ? ? ? ??? v ???? ? ?? ? ???? v oh ????????? ? ??????? ? ????????? minimum high?level output voltage ????????? ? ??????? ? ????????? v in = v ih or v il |i out |  20  a ???? ? ?? ? ???? 2.0 4.5 6.0 ???? ? ?? ? ???? 1.9 4.4 5.9 ??? ? ? ? ??? 1.9 4.4 5.9 ???? ? ?? ? ???? 1.9 4.4 5.9 ??? ? ? ? ??? v ???? ? ?? ? ???? ????????? ? ??????? ? ????????? ????????? ? ??????? ? ????????? v in = v ih or v il |i out |  2.4 ma |i out |  4.0 ma |i out |  5.2 ma ???? ? ?? ? ???? 3.0 4.5 6.0 ???? ? ?? ? ???? 2.48 3.98 5.48 ??? ? ? ? ??? 2.34 3.84 5.34 ???? ? ?? ? ???? 2.20 3.7 5.2 ??? ? ? ? ??? ???? ? ?? ? ? ?? ? ???? v ol ????????? ? ??????? ? ? ??????? ? ????????? maximum low?level output voltage ????????? ? ??????? ? ? ??????? ? ????????? v in = v ih or v il |i out |  20  a ???? ? ?? ? ? ?? ? ???? 2.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 0.1 0.1 0.1 ??? ? ? ? ? ? ? ??? 0.1 0.1 0.1 ???? ? ?? ? ? ?? ? ???? 0.1 0.1 0.1 ??? ? ? ? ? ? ? ??? v ???? ? ?? ? ? ?? ? ???? ????????? ? ??????? ? ? ??????? ? ????????? ????????? ? ??????? ? ? ??????? ? ????????? v in = v ih or v il |i out |  2.4 ma |i out |  4.0 ma |i out |  5.2 ma ???? ? ?? ? ? ?? ? ???? 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 0.26 0.26 0.26 ??? ? ? ? ? ? ? ??? 0.33 0.33 0.33 ???? ? ?? ? ? ?? ? ???? 0.4 0.4 0.4 ??? ? ? ? ? ? ? ??? ???? ???? i in ????????? ????????? maximum input leakage current ????????? ????????? v in = v cc or gnd ???? ???? 6.0 ???? ???? 0.1 ??? ??? 1.0 ???? ???? 1.0 ??? ???  a ???? ? ?? ? ???? i cc ????????? ? ??????? ? ????????? maximum quiescent supply current (per package) ????????? ? ??????? ? ????????? v in = v cc or gnd |i out | = 0  a ???? ? ?? ? ???? 6.0 ???? ? ?? ? ???? 1.0 ??? ? ? ? ??? 10 ???? ? ?? ? ???? 40 ??? ? ? ? ???  a note: information on typical parametric values can be found in chapter 2 of the on semiconductor high?speed cmos data book (dl129/d). ac electrical characteristics (c l = 50 pf, input t r = t f = 6.0 ns) ???? ???? ????????????????? ????????????????? ???? ???? ????????? ????????? guaranteed limit ??? ??? ???? ???? symbol ????????????????? ????????????????? parameter ???? ???? v cc v ???? ???? 55 to 25  c ??? ???  85  c ???? ????  125  c ??? ??? unit ???? ? ?? ? ? ?? ? ???? t plh , t phl ????????????????? ? ??????????????? ? ? ??????????????? ? ????????????????? maximum propagation delay, input a or b to output y (figures 1 and 2) ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 75 30 15 13 ??? ? ? ? ? ? ? ??? 95 40 19 16 ???? ? ?? ? ? ?? ? ???? 110 55 22 19 ??? ? ? ? ? ? ? ??? ns ???? ? ?? ? ? ?? ? ???? t tlh , t thl ????????????????? ? ??????????????? ? ? ??????????????? ? ????????????????? maximum output transition time, any output (figures 1 and 2) ???? ? ?? ? ? ?? ? ???? 2.0 3.0 4.5 6.0 ???? ? ?? ? ? ?? ? ???? 75 30 15 13 ??? ? ? ? ? ? ? ??? 95 40 19 16 ???? ? ?? ? ? ?? ? ???? 110 55 22 19 ??? ? ? ? ? ? ? ??? ns ???? ???? c in ????????????????? ????????????????? maximum input capacitance ???? ???? e ???? ???? 10 ??? ??? 10 ???? ???? 10 ??? ??? pf note: for propagation delays with loads other than 50 pf, and information on typical parametric values, see chapter 2 of the on semiconductor high-speed cmos data book (dl129/d). typical @ 25 c, v cc = 5.0 v c pd power dissipation capacitance (per gate)* 22 pf * used to determine the no?load dynamic power consumption: p d = c pd v cc 2 f + i cc v cc . for load considerations, see chapter 2 of the on semiconductor high?speed cmos data book (dl129/d).
mc74hc02a http://onsemi.com 4 ordering information device package shipping 2 mc74hc02an pdip?14 2000 units / box mc74hc02ang pdip?14 (pb?free) 2000 units / box mc74hc02ad soic?14 55 units / rail mc74hc02adg soic?14 (pb?free) 55 units / rail mc74hc02adr2 soic?14 2500 units / reel mc74hc02adr2g soic?14 (pb?free) 2500 units / reel mc74hc02adt tssop?14* 96 units / rail mc74hc02adtr2 tssop?14* 2500 units / reel 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *this package is inherently pb?free. figure 1. switching waveforms t f t r v cc gnd 90% 50% 10% 90% 50% 10% input a or b output y t phl t plh t tlh t thl *includes all probe and jig capacitance figure 2. test circuit c l * test point device under test output expanded logic diagram (1/4 of the device) y a b
mc74hc02a http://onsemi.com 5 package dimensions pdip?14 n suffix case 646?06 issue n soic?14 d suffix case 751a?03 issue g 17 14 8 b a dim min max min max millimeters inches a 0.715 0.770 18.16 18.80 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l m ??? 10 ??? 10 n 0.015 0.039 0.38 1.01  notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. f hg d k c seating plane n ?t? 14 pl m 0.13 (0.005) l m j 0.290 0.310 7.37 7.87 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. ?a? ?b? g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t ?t? f r x 45 seating plane d 14 pl k c j m  dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 
mc74hc02a http://onsemi.com 6 package dimensions tssop?14 dt suffix case 948g?01 issue o dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c --- 1.20 --- 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane -w-.  s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? section n-n detail e j j1 k k1 detail e f m -w- 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 mc74hc02a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.


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